Introduction
Ceramic Innovation
Organic Innovation
Thermal Management Innovation
Inkjet Printing

Ceramic
   •
Al or Cu Metallised Al203 and AlN substrates
   • “Micro-DBC” technology
   •
LTCC
   •
Dielectric, Resistor and conductive pastes for screen printing

Inkjet
   •
Nanoparticules suspensions : Ag, Au, Pt
   •
InkJet Printer
   • Inkjettable ceramic/metal inks
   •
3D mono and multi-material Inkjet printing services

Photovoltaic
   • Conductive pastes Ag, Ag-Pd
   • Inkjetted front Ag inks and printing services

Organic substrates
   • LGA, BGA, micro-via substrates,
   • SIP interconnects

3D Plastic cavity packages & lids
   • Plastic rings, interposers and Lids
   •
Pre-molded cavity packages based on Advanced Liquid Crystal Polymers (LCP)
   •
Metallised interconnects on plastics (full metallisation for shielding, or proprietary selective method)

Thermal Management
   • Al or Cu carbon fibre composites
   •
Al or Cu Diamond composites
   •
Al - Si Particles composite
   •
3D Custom Shaping and plating finish
   •
Thermal Interface Material (TIM) using Low Temperature Sintering Technology for die attach and assembly materials
   • “Micro-DBC” technology

Assembly Materials & Services
   • Fast turn around chip assembly (from wafer sawing to sealing),
   •
Plastic Air cavity, LGA, BGA or even ceramic assemblies,
   •
Materials for Die attach (NCA, ICA), Balling (flip chip)
   •
Thermal Interface Material (TIM) using Low Temperature Sintering Technology for die attach and assembly materials   
   •
Die processing or bumping using inkjet microfabrication

© 2009 - Cyber'L